• Fine lines and SMT pitch
  • Board thickness 0.008 to 0.250
  • Carbon Ink Contacts
  • Oversized multilayer boards
  • Ball Grid Array (BGA) patterns
  • Blind and buried vias
  • Peelable/Water soluble masks
  • Plated slots and edges
  • Epoxy via plug
  • Blind Buried Vias
  • Control Impedance