AMPEL Capabilities - Printed circuit boards prototypes to production


	Ampel's manufacturing team has experience with a large number of board types and technologies, as well as standard single sided through multilayer product. Whenever you have a special requirement or need a unusual board type, give us a call, we pride ourselves on our customer support. SPECIAL CAPABILITIES Fine lines and SMT pitch Board thickness 0.008 to 0.250 Carbon Ink Contacts Oversized multilayer boards Ball Grid Array (BGA) patterns Blind and buried vias Peelable/Water soluble masks Plated slots and edges BOARD TYPES CEM 1 and CEM3 Polyimide Teflon Flex, Getek and Rigid-Flex High Temperature FR-4 & FR-5 SURFACE FINISHES Solder Mask Over Bare Copper (SMOBC) Hot Air Leveled Solder Electroless nickel/gold (including bondable gold) Electroless White Tin Electroless Silver Entek Screenable silver and carbon Heavy copper layers ENGINEERING SERVICES 24 Hour MODEM Integrated CAM and photo plotting Array Design/Panelization Design For Manufacturability (DFM)		TESTING Precision Gold and Copper thickness measurement Complete micro section system Ionic Contamination 100% Node and Netlist Testing Clam Shell electrical testing Flying grid electrical testing SMT fixtures build in-house Certified test results Statistical Process Control (SPC) AOI system for inner and outerlayers PROCESSING Largest panel size -18 x 30 Maximum number of layers -14 Minimum circuit width -.005 Smallest finished hole -.008 Maximum finished copper -7 oz PTH tolerance -+/- .003 Routed feature tolerance -+/- .005 Solder mask opening allowance Wet mask -.010 per side LPI - .0025 per side Annular ring PTH hole +/- .005